Le design ultra compact de la structure monocoque en aluminium des SSD portables S3+®, rend ceux-ci la solution parfaite pour vos permettre de transporter vos données, en offrant une nouvelle experience de stockage externe.
Une des solutions les plus simples pour rendre plus rapide un ordinateur lent est celle d'ajouter d'autre mémoire. Les mémoires S3+® pour desktop ont été conçues pour améliorer la rapidité et la fiabilité des systèmes et représentent une des meilleures méthodes pour augmenter les performances de votre ordinateur.
MicroSD Class 10
Les cartes microSDHCTM/microSDXCTM sont la solution standard pour augmenter la mémoire de tablets, smartphones, drones et cameras embarquées.
Solid State Drive SATA 3.0
Les SSD S3+® offrent du stockage excellent pour toute application, de tableurs à l'élaboration de textes et a là gestion de contenus. Les modèles sous forme 2,5" avec interface SATA, sont indiqués pour PC desktop et pour notebook, et ils permettent d'avoir une amélioration extraordinaire de la performance des systèmes où ils sont installés, en allongeant leur durée de vie.
in my personal opinion this week, both DRAM and FLASH, will be stable; demand is getting little bit better.
Demand has been ok and we have seen a stable situation on prices for both flash and DRAM.
If you need more information, don’t hesitate to contact me at firstname.lastname@example.org or by skype on live:purchases3plus
Best Regards and Good Work
SSDs Toshiba Announces KumoScale NVMe over Fabrics Software
Toshiba is launching a new software solution for pooling NVMe-based storage in a datacenter environment. The new KumoScale software implements the NVMe over Fabrics protocol (NVMeoF) and allows storage to be access over the network with less than 20µs of added latency compared to NVMe SSDs directly attached to the local system. KumoScale provides abstraction over the individual SSDs so that multiple drives can form a shared pool of storage, from which separate volumes can be allocated to serve as storage for different services running on compute-oriented servers elsewhere in the datacenter.
Samsung Enables More Appealing Gaming Experience with Introduction of 10nm-Class 32GB DDR4 SoDIMMs
Samsung Electronics, the world leader in advanced memory technology, today announced that it has started mass producing the industry’s first 32-gigabyte (GB) double data rate 4 (DDR4) memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10-nanometer (nm)-class process technology that will allow users to enjoy enriched PC-grade computer games on the go, with significantly more capacity, higher speeds, and lower energy consumption.
Ever since Intel announced its 3D Xpoint memory (branded as Optane), the company has claimed that the new class of memory would represent a fundamental leap forward for the entire industry. Proof of these claims has been relatively slow to appear — it’s difficult to replace existing memory technologies, and the existing memory stack (spinning hard drives, NAND, and DRAM) covers a wide range of price points, power consumptions, reliability, and capacity.
Samsung Electronics has launched an 8TB SSD based on the NF1 standard that will allow enterprise data centers to pack more memory in less space.
The 8TB NVMe NF1 SSD is built with 16 of the South Korean tech giant's 512-GB NAND packages each stacked in 16 layers of 256 Gb 3-bit V-NAND chips.
New Realtek PCIe 3.0 x4 NVMe Controllers: RTS5762 & RTS5763DL up to 3.5 GB/s
The market of SSDs is expanding rather rapidly, which encourages new companies to enter the scene. Realtek introduced its first SSD controller two years ago targeting primarily entry-level PCIe drives. This controller has received a lukewarm welcome from makers of SSDs, which was not a surprise as the market is quite packed. As a result, the company changed strategy and its new RTS5762 and RTS5763DL controllers that are aimed at higher-performance models. Realtek demonstrated both products at Computex.
Intel and Micron To Dissolve 3D XPoint Partnership After 2019
A press release from Intel today has clarified the state of the 3D XPoint Joint Venture the company has with Micron. Currently Intel and Micron co-developed the new class of non-volatile memory, with manufacturing at the Intel-Micron Flash Technologies (IMFT) fab in Utah. Intel’s statement today states that for the second generation of memory, the development will also be a joint effort and is expected to complete in the first half of 2019. However the third generation will be developed independently, allowing each company to focus on the separate business needs.
Intel-Micron QLC NAND Yields Less Than 50%, a Prelude to Global SSD Price Hikes?
IMFlash Technologies (IMFT), the Intel-Micron joint venture that manufactures NAND flash and 3D Xpoint memory for use in Intel and Micron end-user products, and Micron Technology-branded NAND flash supply to other SSD manufacturers, is facing a big hurdle with its QLC NAND flash manufacturing ramp-up, which if not checked, could influence SSD prices globally.
Samsung plans to lower memory chip growth as demand slowdown looms: Bloomberg
Samsung Electronics Co Ltd is planning to curb growth in memory chip output next year to keep supplies tight amid an expected slowdown in demand, Bloomberg reported on Thursday, citing people briefed on the matter...
TOSHIBA MEMORY AND WESTERN DIGITAL CELEBRATE THE OPENING OF FAB 6 AND MEMORY R&D CENTER IN YOKKAICHI, JAPAN
Toshiba Memory Corporation and Western Digital Corporation (NASDAQ: WDC) today celebrated the opening of a new state-of-the-art semiconductor fabrication facility, Fab 6, and the Memory R&D Center, at Yokkaichi operations in Mie Prefecture, Japan.
Toshiba Memory started construction of Fab 6, a dedicated 3D flash memory fabrication facility, in February 2017. Toshiba Memory and Western Digital have...